ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,960, issued on Aug. 18, was assigned to Renesas Electronics Corp. (Tokyo). "Pad metallization with oxide layer to reduce deformation of con... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,961, issued on Aug. 18, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Bonded structure having diffused metal oxide... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,962, issued on Aug. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Semiconductor packages including interface members for welding" w... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,963, issued on Aug. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Lasing to attach die to lead frame" was invented by Daiki Komatsu... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,964, issued on Aug. 18, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France). "Integrated circuit package" was invented b... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,965, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor package and metho... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,966, issued on Aug. 18, was assigned to Amkor Technology Singapore Holding Pte. Ltd (Singapore). "Electronic devices and methods of manufac... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,967, issued on Aug. 18, was assigned to SJ Semiconductor(Jiangyin) Corp. (JiangSu, China). "3D fan-out packaging structure of interconnecti... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,968, issued on Aug. 18, was assigned to SJ Semiconductor(Jiangyin) Corp. (Jiangyin City, China). "Fan-out wafer-level packaging structure a... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,969, issued on Aug. 18, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore). "Semiconductor devices and methods of man... Read More